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Cove Announces Method to Form Ultra-Thin Device Wafers
The ThinMOS technology provides a high degree of uniformity across the entire substrate and is a cost-effective solution for semiconductor applications requiring ultra-thin integrated circuit devices.

Cove Announces New Method to Form Ultra-Thin Device Wafers
“ThinMOS provides the solution to form ultra-thin device substrates for a variety of applications. Reducing package size and increasing device performance are critical to the future of the semiconductor industry. ...

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Cove Announces New Method to Form Ultra-Thin Device Wafers
For additional information regarding ThinMOS, potential licensees and investors may contact Mark E. Tuttle at mtuttle@covetechnology.com. This announcement is not an offer to buy ...
http://www.nanowerk.com/news/newsid=12095.php

New Method to Form Ultra-Thin Device Wafers
Two key applications for ThinMOS include thinning substrates for backside illuminated imagers and die stacking. The current trend for CMOS imager sensors to utilize back-side ...
http://www.electroiq.com/index/display/packaging-article-display/367677/articles/advanced-packaging/packaging0/equipment/dicing-and_thinning/2009/08/new-method-to-form-ultra-thin-device-wafers.html

Cove Announces Method to Form Ultra-Thin Device Wafers | Sensors
The ThinMOS technology provides a high degree of uniformity across the entire substrate and is a cost-effective solution for semiconductor applications requiring ultra-thin ...
http://www.sensorsmag.com/bookmark_migration.php?page=618336

ЭЛИНФОРМ. Информационный портал по
Ожидающая патента технология ThinMOS™ представляет собой полностью интегрированный процесс ...
http://www.elinform.ru/news_part_4_page_3.htm

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